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Strengthening Europe’s strategic autonomy through capital marketsCzechoslovak Group lists on EuronextLire la suiteWorld’s largest defence IPO ever recorded.
Learn more about Euronext’s initiatives to enhance financing and visibility for European aerospace and defence companies -
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Where European Government Bonds meet the futureFixed Income derivativesLire la suiteTrade Mini Bond Futures on main European Government Bonds
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Step into Europe’s next phase of Repo ClearingRepo ClearingLire la suiteEuronext is expanding its repo clearing services to boost market access, liquidity provision and collateral optimisation across Europe.
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European CSD modelBuilding the CSD of Choice in EuropeLire la suiteEuronext Securities is shaping the future of European capital markets by enhancing integration, connectivity, and innovation.
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Access the white paperInvesting in the future of Europe with innovative indicesLire la suiteThe first edition of the Euronext Index Outlook series with a particular focus on the European Strategic Autonomy Index.
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About Euronext
Euronext strategic planInnovate for Growth 2027Lire la suiteShaping capital markets for future generations
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- BE Semiconductor Industries
BE Semiconductor Industries
BE Semiconductor Industries celebrates 20th listing anniversary
BE Semiconductor Industries (ticker symbol: BESI) celebrates its 20th anniversary as a public company by opening trading on Euronext Amsterdam with the sounding of the gong.
Richard Blickman, CEO of Besi commented: “We are pleased to be here today to commemorate our initial listing as a public company 20 years ago. Since our inception as a public company in 1995, it has been an exciting journey as Besi has grown from being a local Dutch system and tooling manufacturer to become one of the leading semiconductor assembly equipment manufacturers in the world.’’
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. The company develops leading edge assembly processes and equipment for lead frame, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies.
For more information: www.besi.com