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Listing
Strengthening Europe’s strategic autonomy through capital marketsCzechoslovak Group lists on Euronext更多World’s largest defence IPO ever recorded.
Learn more about Euronext’s initiatives to enhance financing and visibility for European aerospace and defence companies -
Trading
Where European Government Bonds meet the futureFixed Income derivatives更多Trade Mini Bond Futures on main European Government Bonds
-
Clearing
Step into Europe’s next phase of Repo ClearingRepo Clearing更多Euronext is expanding its repo clearing services to boost market access, liquidity provision and collateral optimisation across Europe.
-
CSD
European CSD modelBuilding the CSD of Choice in Europe更多Euronext Securities is shaping the future of European capital markets by enhancing integration, connectivity, and innovation.
-
Technology
Euronext Technology SolutionsHigh-Frequency Trading Solution (HFTS)更多The new generation of high-frequency risk trading platforms, offering the highest performance with ultra-low latency and minimal jitter, all at a low total cost of ownership.
-
Data
-
Indices
Access the white paperInvesting in the future of Europe with innovative indices更多The first edition of the Euronext Index Outlook series with a particular focus on the European Strategic Autonomy Index.
- Regulation
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About Euronext
BE Semiconductor Industries
BE Semiconductor Industries celebrates 20th listing anniversary
BE Semiconductor Industries (ticker symbol: BESI) celebrates its 20th anniversary as a public company by opening trading on Euronext Amsterdam with the sounding of the gong.
Richard Blickman, CEO of Besi commented: “We are pleased to be here today to commemorate our initial listing as a public company 20 years ago. Since our inception as a public company in 1995, it has been an exciting journey as Besi has grown from being a local Dutch system and tooling manufacturer to become one of the leading semiconductor assembly equipment manufacturers in the world.’’
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. The company develops leading edge assembly processes and equipment for lead frame, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies.
For more information: www.besi.com