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Listing
Connecting Europe's Fixed Income MarketsOne connected fixed income ecosystem更多Seamless listing, trading, clearing and settlement for fixed income
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Trading
Connecting Europe's Fixed Income MarketsOne connected fixed income ecosystem更多Seamless listing, trading, clearing and settlement for fixed income
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Clearing
Connecting Europe's Fixed Income MarketsOne connected fixed income ecosystem更多Seamless listing, trading, clearing and settlement for fixed income
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CSD
European CSD modelBuilding the CSD of Choice in Europe更多Euronext Securities is shaping the future of European capital markets by enhancing integration, connectivity, and innovation.
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Technology
Euronext Technology SolutionsHigh-Frequency Trading Solution (HFTS)更多The new generation of high-frequency risk trading platforms, offering the highest performance with ultra-low latency and minimal jitter, all at a low total cost of ownership.
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Data
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Indices
Access the white paperNext generation of indices更多This white paper marks the second edition of Euronext’s Index Outlook series, a recurring publication designed to give investors deeper insight into our index innovation agenda and the structural forces shaping global markets.
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About Euronext
BE Semiconductor Industries
07/12/2015
BE Semiconductor Industries celebrates 20th listing anniversary
BE Semiconductor Industries (ticker symbol: BESI) celebrates its 20th anniversary as a public company by opening trading on Euronext Amsterdam with the sounding of the gong.
Richard Blickman, CEO of Besi commented: “We are pleased to be here today to commemorate our initial listing as a public company 20 years ago. Since our inception as a public company in 1995, it has been an exciting journey as Besi has grown from being a local Dutch system and tooling manufacturer to become one of the leading semiconductor assembly equipment manufacturers in the world.’’
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. The company develops leading edge assembly processes and equipment for lead frame, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies.
For more information: www.besi.com